Wide Field of View High-NA Objective Lenses for SWIR

• The corresponding clear image over 900-1700nm can be obtained within the depth of field.

• PAL-10-SWIR-HRWF-Si0520 and PAL-10-SWIR-HRWF-Si0775 are objective lenses for observing the underside of the silicon wafer. The aberration is corrected for silicon wafer thickness of 0.52 mm and 0.775 mm, respectively.

• Wide field of view and high NA compatible observation barrel (OUCI-SWIR-HRWF) available separately.

Attention

• When an objective lens is used in laser processing, use the diameter of the incident beam to extend to a size of half the pupil diameter (1/e2). A small light spot cannot be achieved when the incident beam is too narrow. Please note if there is a laser energy density increase, there will be a high possibility of damage to the objective lens.

• The surface of an objective lens can be contaminated by debris during processing. To avoid this, please have sufficient working distance (WD) and insert a thin protective glass on the objective.

• Magnification is the value when using the imaging lens f=200mm. When used in a microscope lens barrel from other manufacturers there may be different magnifications. The actual magnification should be calculated from the ratio of the focal length of the objective lens and the focal length of the imaging lens to verify the focal length of the imaging lens barrel to be used.